Strategic Insights into Semiconductor Plating System Growth
The Global Semiconductor Plating System Market, valued at US$ 5.1 billion in 2022, is anticipated to grow at a compound annual growth rate (CAGR) of 4.8% from 2023 to 2031, reaching a valuation of US$ 7.7 billion by the end of 2031.
The increasing usage of electronic components in the automotive sector and the growing global demand for semiconductors are key factors driving market development. Semiconductor plating enhances the solderability of substrates, protects against wear, and improves corrosion resistance and electrical conductivity.
Leading manufacturers are focusing on designing advanced products to improve plating technology performance. Growth strategies such as collaborations, mergers and acquisitions, product launches, and the development of worldwide distribution networks are helping companies capitalize on lucrative semiconductor plating system opportunities.
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Market Introduction
The semiconductor industry predominantly manufactures chips from silicon plated with materials like gold, copper, and silver to ensure product quality. The rising use of semiconductor components in automobiles and connected devices is positively impacting the performance of semiconductor components.
Copper plating is gaining popularity due to the industry's shift towards complex packaging systems. Copper plating solutions are favored for their outstanding coplanarity, low deposit roughness, and high-speed plating. Semiconductor plating systems include fully automatic, semi-automatic, and manual types.
Increase in Usage of Electronic Components in the Automotive Sector
The automotive sector is rapidly growing, with increasing demand for fuel-efficient, autonomous, and technologically advanced vehicles in both developing and developed countries. Modern vehicles feature heads-up displays, mobile phone integration, and autonomous driving aids, pushing consumers towards vehicles with enhanced comfort and performance.
Key automotive manufacturers are developing electric vehicles with advanced electronics, leading to increased demand for automotive semiconductors and, consequently, semiconductor plating systems. Electric vehicle production is expected to rise globally, with India's electric vehicle market projected to reach US$ 7.1 billion by 2025 and US$ 206.0 billion by 2030, further boosting demand for semiconductor plating systems.
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Growth in Demand for Semiconductors Augmenting Market Statistics
Semiconductors are increasingly used in consumer electronics such as microwaves, refrigerators, computers, mobile phones, and gaming consoles. They are vital components in embedded systems, enabling products like central heating systems, GPS systems, fitness trackers, and televisions.
The emergence of Internet of Things (IoT) and Artificial Intelligence (AI) technologies is creating lucrative opportunities for manufacturers in the semiconductor plating system market.
High Demand for Fully Automatic Semiconductor Plating Systems
Fully automatic semiconductor plating systems accounted for 39.1% market share in 2022 and are projected to dominate during the forecast period. These systems are powerful, cost-efficient, easy to use, and designed for electrochemical deposition (ECD) and surface preparation wet processing, particularly for ≤200 mm wafers.
Surge in Adoption of Electroplating Technology
Electroplating technology held 57.2% of the market share in 2022 and is expected to lead during the forecast period, driven by the expansion of the electronics industry and the demand for cost-effective and sustainable semiconductor plating technologies.
Regional Outlook of the Global Semiconductor Plating System Industry
Asia Pacific held a prominent market share of 46.8% in 2022, expected to continue dominating due to the strong presence of semiconductor manufacturers in the region. North America's market size is anticipated to increase steadily, supported by government initiatives for the semiconductor sector.
Analysis of Key Players
The global semiconductor plating system market is consolidated, with major companies controlling a significant share. Leading players are investing in R&D, expanding product portfolios, and pursuing mergers and acquisitions to capitalize on market opportunities.
Key players include ACM Research, Inc., Applied Materials, Inc, ASMPT, ClassOne Technology, Inc., EBARA Technologies, Inc., Hitachi Power Solutions Co., Ltd., LAM RESEARCH CORPORATION, MITOMO SEMICON ENGINEERING CO., LTD., RENA Technologies, and TANAKA HOLDINGS Co., Ltd.
Key Developments
- ACM Research, Inc.: In May 2022, ACM Research received a contract from China-based OSAT for 10 Ultra ECP ap high-speed plating tools, previously used by OSAT customers for advanced WLP applications.
- ClassOne Technology, Inc.: In March 2021, ClassOne Technology received a repeat order of the Solstice S8 Electroplating System from i3 Microsystems. The system includes the proprietary CopperMax chamber for advanced copper plating and handles several surface preparation functions.
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